Alpha's technical capabilities and extensive experience in high end technology PCBs in the RF, non-RF and mixed PCBs are among the industry leaders. Our growth is also focused on thermal management which is becoming increasingly important for the emerging electronic devices in telecommunication and hybrid devices, HDI and building circuits for the emerging markets in automotives, displays, HDI, telecommunication, medical, defense, etc.
Below is a short list of our technical capabilities.
ACC Capabilities at a Glance |
|
|---|---|
| Layer Count | 1 to 30+ |
| Largest Panel Size | 18" x 24" |
| Smallest Circuit Width/Spacing | 3 mil; 2 mil for prototypes |
| Material Types | Rogers, Polyimide, PET, LPC, FR4,Metal-Core Heat Sinks |
| Smallest Mech. Drilled Hole | .004" |
| Hole Size & Dim. Tolerances | +/- .003" and +/- .002" |
| Finishes / Lead Free | ENIG, Immersion Silver, Immersion Tin,OSP, Lead-Free HAL, Hard TAB Gold, Wire Bondable Soft Gold |
| Electrical Testing | Flying Probe |
| Fabrication | Routing & Scoring, Array Layouts |
| Plasma Processing Unit | Printed Electronics with Silver Ink Bumping, Metal-Core, Heat Sink |
| Laser | Drilling, Routing and Trimming |
Specification |
Current Capability |
Future Capabilities |
|---|---|---|
| Substrate Minimum Thickness | .001" | .001" |
| Max. Operating Temperature | 356F | 500F |
| Maximum Layer Count | 24+ | 30+ |
| Silver Conductive Ink Impedance | < 6 m? / Sq / Mil | < 6 m? / Sq / Mil |
Specification |
Current Capability |
Future Capabilities |
|---|---|---|
| Minimum Finished Hole Size | .002" | .001" |
| Blind/Buried Vias | .003" - .002" | .001" |
| Routing Tolerance | .005" | .005" |
| Scoring Tolerance | .002" | .002" |
Specification |
Current Capability |
Future Capabilities |
|---|---|---|
| Minimum Lines/Spaces | .002" | .001" |
| Min. Quad Flat Pack Pitch | .016" | .016 - .012' |
| Minimum Pad Size | .004" | .004" - .003" |
| Solder mask Registration | .003" | .002" |
| Solder mask Tolerance | .002" | .002" |
Specification |
Current Capability |
Future Capabilities |
|---|---|---|
| Finished Copper Thickness | 20 ounce | 20 ounce |
| Hot Air Solder Leveling | Yes | Yes |
| Lead-Free Solder (HAL) | Yes | Yes |
| Full Body Hard Ni/Au | Yes | Yes |
| Immersion Gold/Silver | Yes | Yes |
| OSP | Yes | Yes |